Patents recorded as loan collateral (security interest)
IP_SECURITY_INTEREST_RECORDED · THERMAL ENGINEERING INTERNATIONAL USA INC
THERMAL ENGINEERING INTERNATIONAL (USA) INC. recorded a security interest over 1 patent to BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT, recorded 2024-06-26.
Evidence
Conveyance: SECURITY INTEREST | Assignor: THERMAL ENGINEERING INTERNATIONAL (USA) INC. | Assignee: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT | Patents: 16701379
location reel 67848/frame 666 · rule si-v1 · evidence hash 987e709249981b76…
severity high (78) · confidence 0.95 · as of 2024-06-26