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Patents recorded as loan collateral (security interest)

IP_SECURITY_INTEREST_RECORDED · BULK MOLDING COMPOUNDS

BULK MOLDING COMPOUNDS, INC. recorded a security interest over 2 patents to GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT, recorded 2023-05-18.

Evidence
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). | Assignor: BULK MOLDING COMPOUNDS, INC. | Assignee: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT | Patents: 6576170, 7047626
location reel 63684/frame 563 · rule si-v1 · evidence hash a2926dbe6467884f…

severity high (78) · confidence 0.95 · as of 2023-05-18

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